Itanna ic Chip Atilẹyin Iṣẹ BOM TPS54560BDDAR iyasọtọ awọn paati ohun elo eletiriki ic tuntun
Ọja eroja
| ORISI | Apejuwe |
| Ẹka | Awọn iyika Iṣọkan (ICs) |
| Mfr | Texas Instruments |
| jara | Eco-Mode™ |
| Package | Teepu & Reel (TR) Teepu Ge (CT) Digi-Reel® |
| SPQ | 2500T&R |
| Ipo ọja | Ti nṣiṣe lọwọ |
| Išẹ | Igbesẹ-isalẹ |
| O wu iṣeto ni | Rere |
| Topology | Ẹtu, Pipin Rail |
| Ojade Irisi | adijositabulu |
| Nọmba ti Ijade | 1 |
| Foliteji - Iṣawọle (min) | 4.5V |
| Foliteji - Iṣawọle (Max) | 60V |
| Foliteji - Ijade (Min/Ti o wa titi) | 0.8V |
| Foliteji - Ijade (Max) | 58.8V |
| Lọwọlọwọ - Ijade | 5A |
| Igbohunsafẹfẹ - Yipada | 500kHz |
| Amuṣiṣẹpọ Rectifier | No |
| Awọn iwọn otutu ti nṣiṣẹ | -40°C ~ 150°C (TJ) |
| Iṣagbesori Iru | Oke Oke |
| Package / Ọran | 8-PowerSOIC (0.154 "Iwọn 3.90mm) |
| Package Device Olupese | 8-SO PowerPad |
| Nọmba Ọja mimọ | TPS54560 |
1.Iforukọsilẹ IC, imọ gbogbogbo package ati awọn ofin sisọ:
Iwọn iwọn otutu.
C=0°C si 60°C (ipe owo);I = -20°C si 85°C (ipe ile ise);E = -40°C si 85°C (ipe ile ise ti o gbooro);A=-40°C si 82°C (igi aerospace);M=-55°C si 125°C (ipe ologun)
Package iru.
A-SSOP;B-CERQUAD;C-TO-200, TQFP;D-seramiki Ejò oke;E-QSOP;F-Seramiki SOP;H- SBGAJ-Seramiki DIP;K-TO-3;L-LCC, M-MQFP;N-DIP DIP;N-DIP;Q PLCC;R - DIP seramiki dín (300mil);S - TO-52, T - TO5, TO-99, TO-100;U - TSSOP, uMAX, SOT;W - Factor Fọọmu Kekere (300mil) W-Wide kekere fọọmu fọọmu (300 mil);X-SC-60 (3P, 5P, 6P);Y-Dín Ejò oke;Z-TO-92, MQUAD;D-Die;/ PR-fikun ṣiṣu;/W-Wafer.
Nọmba awọn pinni:
a-8;b-10;c-12, 192;d-14;e-16;f-22,256;g-4;h-4;emi -4;H-4;I-28;J-2;K-5, 68;L-40;M-6, 48;N 18;O-42;P-20;Q-2, 100;R-3, 843;S-4, 80;T-6, 160;U-60 -6,160;U-60;V-8 (yika);W-10 (yika);X-36;Y-8 (yika);Z-10 (yika).(yika).
Akiyesi: Lẹta akọkọ ti suffix lẹta mẹrin ti kilasi wiwo jẹ E, eyiti o tumọ si pe ẹrọ naa ni iṣẹ antistatic.
2.Idagbasoke imọ-ẹrọ apoti
Awọn iyika iṣọpọ akọkọ ti lo awọn idii alapin seramiki, eyiti o tẹsiwaju lati lo nipasẹ ologun fun ọpọlọpọ ọdun nitori igbẹkẹle wọn ati iwọn kekere.Iṣakojọpọ iyika ti iṣowo laipẹ yipada si awọn idii ila-meji meji, ti o bẹrẹ pẹlu seramiki ati lẹhinna ṣiṣu, ati ni awọn ọdun 1980 nọmba pin ti awọn iyika VLSI ti kọja awọn opin ohun elo ti awọn idii DIP, nikẹhin ti o yori si ifarahan ti awọn akopọ pin grid ati awọn gbigbe ni ërún.
Apopọ oke dada farahan ni ibẹrẹ awọn ọdun 1980 ati pe o di olokiki ni apakan nigbamii ti ọdun mẹwa yẹn.O nlo a finer pin ipolowo ati ki o ni gull-apakan tabi J-sókè pin apẹrẹ.Circuit Integrated Small-Outline (SOIC), fun apẹẹrẹ, ni 30-50% kere si agbegbe ati pe o jẹ 70% kere si nipọn ju DIP deede.Yi package ni o ni gull-apakan-sókè awọn pinni protruding lati awọn meji gun mejeji ati ki o kan pinni pa 0,05 ".
Circuit Integrated-Outline Kekere (SOIC) ati awọn idii PLCC.ninu awọn 1990s, biotilejepe PGA package ti a si tun igba lo fun ga-opin microprocessors.PQFP ati tinrin kekere-ila package (TSOP) di awọn ibùgbé package fun ga pin ka awọn ẹrọ.Awọn microprocessors giga-giga Intel ati AMD gbe lati awọn idii PGA (Pine Grid Array) si awọn idii Land Grid Array (LGA).
Awọn idii Ball Grid Array bẹrẹ si han ni awọn ọdun 1970, ati ni awọn ọdun 1990 ti ni idagbasoke package FCBGA pẹlu pin ka ti o ga ju awọn idii miiran lọ.Ninu package FCBGA, kú naa ti yipada si oke ati isalẹ ati sopọ si awọn boolu ti o ta lori package nipasẹ ipilẹ ipilẹ PCB kan ju awọn okun waya lọ.Ni ọja oni, apoti tun jẹ apakan lọtọ ti ilana naa, ati imọ-ẹrọ ti package tun le ni ipa lori didara ati ikore ọja naa.
